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This 20-layer industrial control PCB is designed for high-density, high-reliability applications in harsh industrial environments, such as automation systems, robotics, and power distribution networks. With 3.5/3.5MIL minimum line/space, it supports complex routing for advanced control modules, high-speed data interfaces, and multi-voltage domains. Built on FR-4 (Tg 170°C), the board ensures thermal stability and mechanical robustness under extreme temperatures and vibration. The 1OZ outer copper layers provide low resistance for power delivery, while HOZ inner layers optimize signal integrity and reduce crosstalk. OSP surface finish enhances solderability and corrosion resistance, paired with deep green solder mask for aesthetic appeal and component visibility. CNC+V-CUT machining ensures precision, and second-order HDI process enables ultra-dense interconnects for compact designs. Ideal for industrial automation, smart factories, and mission-critical infrastructure requiring long-term durability.
| Parameter Category | Specification |
|---|---|
| Number of Layers | 20 Layer |
| Minimum Line/Space | 3.5/3.5 MIL |
| Board Thickness | 2.40 mm |
| Substrate Material | FR-4 (Tg 170°C) |
| Copper Thickness | 1OZ (Outer Layers), HOZ (Inner Layers) |
| Solder Mask Color | Deep Green |
| Silkscreen Color | White |
| Machining | CNC + V-CUT |
| Surface Finish | OSP (Organic Solderability Preservative) |
| Additional Tech | Second-Order Double HDI Process |
