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| PCBA Specification | Detail |
|---|---|
| Layer Count | 2-Layer HDI Design (1+N+1 structure for compact routing) |
| Min Line Width/Space | 8/8 MIL (0.203/0.203 mm) |
| Board Thickness | 1.60 mm ±10% (FR-4 substrate) |
| Material | FR-4 (Epoxy Glass Fiber) – High thermal stability and mechanical durability |
| Outer Copper Thickness | 1 OZ (~35μm) – Supports current densities up to 2A per trace |
| Inner Copper Thickness | N/A – Designed for single-sided routing with no inner layers |
| Solder Mask Color | Deep Green – High precision for component placement and IPC-2221B compliance |
| Silk Screen Color | White |
| Molding Process | CNC (±0.05mm tolerance for complex profiling) |
| Surface Finish | Immersion Gold 1U” (0.05–0.1μm thickness) – RoHS-compliant solderability |
| Advanced Technology | 4OZ Thick Copper Plate – Enhanced power distribution and thermal efficiency |
