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This 4-layer gold finger card board is designed for high-speed data transmission and reliable connectivity in advanced electronic systems, such as servers, storage devices, and precision instruments. With 4/4MIL minimum line/space, it supports dense routing for high-frequency signals while maintaining dimensional accuracy. Built on FR-4 (Tg 150°C), the board ensures thermal stability and mechanical robustness under extreme conditions. The 1OZ copper layers (outer/inner) provide low resistance and efficient power delivery, paired with electroplated gold fingers (2μ”) for enhanced conductivity and oxidation resistance. Green solder mask and white silkscreen improve component visibility and aesthetics. CNC+beveling ensures precise edge finishing, making it ideal for applications requiring frequent insertion and removal, such as memory cards and expansion slots.
| Parameter Category | Specification |
|---|---|
| Number of Layers | 4 Layer |
| Minimum Line/Space | 4/4 MIL |
| Board Thickness | 1.60 mm |
| Substrate Material | FR-4 (Tg 150°C) |
| Copper Thickness | 1OZ (Outer/Inner Layers) |
| Solder Mask Color | Green |
| Silkscreen Color | White |
| Machining | CNC + Beveling |
| Surface Finish | Electroplated Gold (2μ”) |
| Additional Tech | Gold Fingers + Beveling |
