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| PCBA Specification | Detail |
|---|---|
| Layer Count | 8-Layer HDI Design (1+3+1 Stack-Up) with microvias for high-density routing |
| Min Line Width/Space | 3.5/3.5 MIL (0.089/0.089 mm) |
| Board Thickness | 1.60 mm ±10% (FR-4 TG150°C substrate) |
| Material | FR-4 TG150°C (Epoxy Glass Fiber with Tg ≥150°C, high thermal stability) |
| Outer Copper Thickness | 1 OZ (~35μm) |
| Inner Copper Thickness | 1 OZ (~35μm) |
| Solder Mask Color | Black (high precision, RoHS compliant) |
| Silk Screen Color | White |
| Molding Process | CNC (±0.05mm tolerance for complex profiling) |
| Surface Finish | Immersion Gold 2U” (lead-free, enhanced solderability and durability) |
| Advanced Technology | Metal Edge Banding (mechanical strength and EMI shielding) |
