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This 8-layer module PCB is designed for high-density, high-reliability applications in advanced electronic systems, such as industrial automation, communication devices, and consumer electronics. With 3.5/3.5MIL minimum line/space, it supports complex routing for integrated modules and high-speed interfaces. Constructed on FR-4 (Tg 150°C), the board ensures thermal stability and mechanical durability under varying environmental conditions. The 1OZ copper layers (outer/inner) provide low resistance and efficient power delivery, while PTH half-hole technology enables ultra-dense interconnects for compact designs. Green solder mask and white silkscreen enhance component visibility and aesthetic appeal. CNC+stamping holes ensure precise assembly, and gold plating (2μm) prevents oxidation and ensures long-term solderability. Ideal for 5G infrastructure, smart factories, and high-performance consumer devices.
| Parameter Category | Specification |
|---|---|
| Number of Layers | 8 Layer |
| Minimum Line/Space | 3.5/3.5 MIL |
| Board Thickness | 1.20 mm |
| Substrate Material | FR-4 (Tg 150°C) |
| Copper Thickness | 1OZ (Outer/Inner Layers) |
| Solder Mask Color | Green |
| Silkscreen Color | White |
| Machining | CNC + Stamping Holes |
| Surface Finish | Gold Plating (2μm) |
| Additional Tech | PTH Half-Hole Technology |
