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This 10-layer module PCB is engineered for high-density, high-reliability applications in advanced electronic systems, such as communication devices, industrial automation, and consumer electronics. With 3.5/3.5MIL minimum line/space, it supports complex routing for integrated modules and high-speed interfaces. Constructed on FR-4 (Tg 150°C), the board ensures thermal stability and mechanical durability under varying environmental conditions. The 1OZ outer copper layers provide low resistance for power delivery, while HOZ inner layers optimize signal integrity and reduce crosstalk. Black solder mask and white silkscreen enhance component visibility and aesthetic appeal. CNC+stamping holes ensure precise assembly, and 10-layer 1st-order HDI+PTH half-hole technology enables ultra-dense interconnects for compact designs. Ideal for 5G infrastructure, smart factories, and high-performance consumer devices.
| Parameter Category | Specification |
|---|---|
| Number of Layers | 10 Layer |
| Minimum Line/Space | 3.5/3.5 MIL |
| Board Thickness | 1.60 mm |
| Substrate Material | FR-4 (Tg 150°C) |
| Copper Thickness | 1OZ (Outer Layers), HOZ (Inner Layers) |
| Solder Mask Color | Black |
| Silkscreen Color | White |
| Machining | CNC + Stamping Holes |
| Surface Finish | Gold Plating (2μm) |
| Additional Tech | 10-Layer 1st-Order HDI + PTH Half-Hole |
