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| PCBA Specification | Detail |
|---|---|
| Layer Count | 4-Layer High-Density HDI Design (1st Order HDI) |
| Min Line Width/Space | 4/4 MIL (0.102/0.102 mm) |
| Board Thickness | 1.00 mm ±10% (FR-4 TG140°C substrate) |
| Material | FR-4 TG140°C (Epoxy Glass Fiber with Tg ≥140°C, high thermal stability) |
| Outer Copper Thickness | 1 OZ (~35μm) |
| Inner Copper Thickness | 1 OZ (~35μm) |
| Solder Mask Color | Yellow Oil (high precision, RoHS compliant) |
| Silk Screen Color | White |
| Molding Process | CNC + V-CUT (±0.05mm tolerance for complex profiling and edge cutting) |
| Surface Finish | Non-Copper Tin Spray (lead-free, cost-effective solderability) |
| Advanced Technology | 1st Order HDI (1+N+1 structure with blind vias) for compact routing
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