Key Features:
- High-Density Routing: 4mil/4mil trace/space enables 100+ I/O per square inch for PCIe 5.0/USB4 Gen 2 applications.
- Advanced Signal Integrity: 50Ω/100Ω differential pairs with **<10dB insertion loss** at 24GHz for AI/ML accelerators and 5G mmWave modules.
- Thermal Efficiency: ΔT ≤ 3°C under high-power loads thanks to copper planes and optimized thermal vias for server GPUs and edge computing devices.
- Mechanical Robustness: 100–250 MPa tensile strength ensures durability in rugged laptops and industrial automation systems.
- Precision Manufacturing: Second-order HDI process combines laser drilling (6mil vias) with electroplating for zero-crosstalk interconnects, validated by IPC-6012B Class 12 standards.
Ideal Applications:
- Consumer Electronics: Ultra-thin flagship smartphones with foldable displays and under-display cameras.
- Data Center Hardware: AI server motherboards with PCIe 5.0 x16 slots and DDR5 memory controllers.
- Telecommunications: 5G CPE devices and microwave backhaul units requiring high-frequency signal integrity (up to 60GHz).
- Industrial IoT: Smart factories control systems with high-reliability connectors and EMC-compliant designs.
Why Partner With Us?
- Customization: Tailored layer stack configurations (e.g., 7 signal + 7 power layers) and impedance profiles for niche applications.
- Cost Efficiency: Lean manufacturing reduces prototyping costs by 30% with 100% AOI/X-ray inspection for defect-free production.
- Innovation: Graphene-enhanced substrates for 20% improved thermal conductivity and nanoscale laser drilling for **±0.5mil via alignment tolerance**.
Elevate your next-gen electronics with 14-layer second-order HDI plates that balance density, speed, and reliability. Trust our expertise to power the future of high-performance computing and connectivity!