Key Features:
- Superior Thermal Management: Rapidly dissipates heat from 10A–200A current loads, reducing junction temperatures and extending LED lifespan by 30% compared to traditional FR-4 PCBs
- Precision Manufacturing: **±0.05mm dimensional tolerance** ensures seamless integration into compact LED modules (e.g., automotive headlight assemblies, smartphone flash units)
- Versatile Material Options: Pure copper (C1100) for cost-effective thermal performance or brass alloys (C1020) for enhanced mechanical strength, both with nickel/gold plating for corrosion resistance
- High-Current Capacity: Supports 2000–3500 lm brightness in high-power LED applications (e.g., XENCN N30ZC LED headlights)
- Durable Surface Finishes: Immersion Gold or OSP coatings ensure long-term solderability and reliability in harsh environments
Ideal Applications:
- Automotive Lighting: Ultra-bright, low-heat automotive headlights with adaptive beamforming and **-40°C to +125°C** temperature resistance
- Industrial & Outdoor Lighting: High-efficiency LED strips and UV-resistant substrates for 24/7 operation in warehouses and public spaces
- Consumer Electronics: Slim, high-luminosity LED flash modules for smartphones and RGB smart lighting systems with IP67 waterproofing
- Medical & Aerospace: Sterilizable substrates for portable diagnostic devices and high-reliability aerospace lighting
Why Partner With Us?
- Material Innovation: Graphene-enhanced copper interfaces for 20% faster heat dissipation and nanoscale textured surfaces for improved solderability
- Cost Efficiency: Lean manufacturing reduces prototyping costs by 25% with 100% AOI/X-ray inspection for defect-free production
- Compliance: Certified to IPC standards and RoHS 3.0, ensuring safety and environmental sustainability
Elevate your lighting and power systems with copper substrates that combine performance, durability, and innovation. Trust our expertise to power the future of illumination!