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This 6-layer mobile motherboard PCB is designed for high-performance, compact, and reliable operation in smartphones, 5G devices, and portable electronics. With 3.2/3.2MIL minimum line/space, it supports high-density routing for advanced processors, memory modules, and RF components. Constructed on FR-4 (Tg 150°C), the board ensures thermal stability and durability under varying temperature conditions
. The 1OZ copper layers (outer/inner) provide low resistance and efficient power delivery, while gold plating (1μm) prevents oxidation and extends component lifespan
. Green solder mask and white silkscreen enhance component visibility and aesthetic appeal. CNC+stamping holes enable precise assembly, and HDI buried blind vias optimize space utilization and signal integrity for complex designs
. Ideal for smartphones, IoT devices, and high-speed communication systems requiring compact, high-reliability PCBs.
| Parameter Category | Specification |
|---|---|
| Number of Layers | 6 Layer |
| Minimum Line/Space | 3.2/3.2 MIL |
| Board Thickness | 1.20 mm |
| Substrate Material | FR-4 (Tg 150°C) |
| Copper Thickness | 1OZ (Outer/Inner Layers) |
| Solder Mask Color | Green |
| Silkscreen Color | White |
| Machining | CNC + Stamping Holes |
| Surface Finish | Gold Plating (1μm) |
| Additional Tech | HDI Buried Blind Vias |
