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| PCBA Specification | Detail |
|---|---|
| Layer Count | 8 Layers |
| Min Line Width/Space | 3.5/3.5 MIL (0.089/0.089 mm) |
| Board Thickness | 1.60 mm ±10% (FR-4 TG150 substrate) |
| Material | FR-4 TG150°C (Epoxy Glass Fiber with Tg ≥150°C) |
| Outer Copper Thickness | 1 OZ (~35μm) |
| Inner Copper Thickness | 1 OZ (~35μm) |
| Solder Mask Color | Black |
| Silk Screen Color | White |
| Molding Process | CNC |
| Surface Finish | OSP (Organic Solderability Preservatives) |
| Advanced Technology | Via-in-Pad (enhances density and thermal management)
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