Key Features:
- Advanced Layer Stack: 4+2 or 3+3 hybrid configurations optimize routing for complex systems like smartphones, AR/VR headsets, and IoT modules
- High-Frequency Performance: **<8dB insertion loss** at 24GHz ensures seamless 5G RF and mmWave signal integrity; differential pairs (100Ω) support PCIe 5.0 and DDR5
- Thermal Management: Graphene-enhanced substrates and thermal vias dissipate heat from high-power components (e.g., AI chips, 108MP cameras)
- Durability: **≥100k flex cycles** (PI zones) withstand repeated bending in wearable devices and hinged electronics
- Aesthetic & Functional Appeal: Black solder mask with immersion gold finish provides premium visual contrast and corrosion resistance for visible applications
Ideal Applications:
- Consumer Electronics: Ultra-slim smartphones, foldable tablets, and smartwatches with in-cell touch integration and haptic feedback
- Medical Devices: Implantable defibrillators, neural stimulators, and portable diagnostic equipment requiring sterilization resistance and biocompatibility
- Industrial & Automotive: Rugged interconnects for industrial sensors, on-board chargers (OBCs), and automotive infotainment systems
Why Partner With Us?
- Customization: Tailored flex zones, trace widths (3μm–100μm), and shielding configurations for niche applications
- Cost-Effective Production: Lean manufacturing reduces prototyping costs by 30% with 100% AOI/X-ray inspection for defect-free delivery
- Innovation: Low-loss LCP materials for GHz-range performance and halogen-free processes for sustainability
Elevate your device designs with 6-layer flexible boards that balance flexibility, speed, and reliability. Trust our expertise to deliver solutions for tomorrow’s most demanding electronics!