Key Features:
- Complex Layer Stack: 3+3 or 4+2 rigid-flex configurations enable optimized routing for camera sensors, ISPs, and display interfaces.
- High-Speed Performance: Impedance-controlled traces (100Ω differential pairs) ensure seamless USB 4.0, HDMI 2.1, and MIPI CSI-2 signals with **<8dB insertion loss** at 24GHz.
- Thermal Efficiency: Thermal vias and graphene-enhanced substrates dissipate heat from high-power camera modules (e.g., 108MP sensors).
- Durability: **≥80k flex cycles** (PI zones) withstand repeated bending in wearable cameras or automotive dashcams.
- Precision Manufacturing: laser-drilled micro-vias and AOI/X-ray inspection guarantee zero defects in fine-pitch traces and via structures.
Ideal Applications:
- Consumer Electronics: Ultra-slim smartphone cameras, AR/VR headsets with 3D structured light sensors.
- Industrial Automation: High-speed vision systems for robotics, quality control, and autonomous vehicles.
- Medical Devices: Flexible endoscopes, portable ultrasound probes, and diagnostic imaging systems.
- Surveillance: Rugged image headers for IP cameras, drones, and outdoor monitoring systems.
Why Partner With Us?
- Customization: Tailored layer counts, trace widths (3μm–100μm), and shielding configurations for niche imaging applications.
- Cost Efficiency: Lean manufacturing reduces prototyping costs by 35% with 100% defect-free AOI/X-ray inspection.
- Innovation: Nanoscale silver paste for low-resistance touch sensors and halogen-free materials for sustainability.
Elevate your imaging systems with 6-layer rigid-flex PCBs that balance speed, power, and flexibility. Trust our expertise to deliver solutions for tomorrow’s most advanced cameras and sensors!
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