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Adapter double-sided flexible board

Product Parameters for Adapter Double-Sided Flexible Board

Parameter Specification
Material High-TG FR4 (rigid areas) + ​Polyimide (PI) (flex areas) for durability and flexibility
Thickness 0.1mm–0.3mm (standard) / ​0.05mm ultra-thin for compact adapters
Conductivity Copper traces with ​**≤0.1Ω/sq** resistance (high-current paths)
Layer Configuration 2-layer hybrid design (rigid and flex regions with varying layer counts)
Pitch & Design 0.15mm–0.4mm pitch for BGA/FPC connectors; ​micro-pad designs for precision
Minimum Hole Diameter 0.2mm (PTH) / ​0.1mm (NPTH) with ​**±0.02mm tolerance**
Minimum Trace/Space 0.05mm/0.05mm (ultra-high-density routing)
Bend Radius ​**≥1mm** (PI-based flex zones) for repeated bending
Temperature Range ​**-40°C to +105°C** (operational); ​**+260°C** short-term (PI thermal tolerance)
Surface Finish ENIG (gold plating) for corrosion resistance; ​HASL for cost-sensitive designs
Flex Life ​**≥50k flex cycles** (PI) for dynamic applications (e.g., wearable device connectors)
Testing Standards IPC-6012B (quality), ​IEC 62153 (EMC), ​MIL-STD-883J (reliability)

Adapter Double-Sided Flexible Boards | Ultra-Flexible, High-Density Solutions for Modern Adapters
Engineered for ​compact electronic devices and ​wearable technology, our ​double-sided flexible boards combine the durability of ​High-TG FR4 with the flexibility of ​Polyimide (PI) substrates, delivering ​unmatched reliability and ​space-saving designs. Ideal for smartphone adapters, IoT modules, and communication devices, these boards support ​high-speed data transmission and ​dynamic bending while meeting global quality standards.

 

Key Features:

  • Advanced Layer Stack: ​2-layer hybrid design optimizes routing density and mechanical strength for adapters with integrated power and signal lines.
  • High-Frequency Performance: ​Impedance-controlled traces (≤0.1Ω/sq resistance) ensure seamless data transfer for USB 4.0, PCIe 4.0, and 5G RF applications.
  • Thermal Management: ​Thermal vias and ​graphene-enhanced substrates dissipate heat generated by high-power components (e.g., fast-charging modules).
  • Durability: ​**≥50k flex cycles** (PI zones) withstand repeated bending in wearable device connectors and hinged electronics.
  • Precision Manufacturing: ​Laser drilling and ​automated optical inspection (AOI) ensure zero defects in micro-interconnects and fine-pitch solder mask applications.

Ideal Applications:

  • Consumer Electronics: Ultra-slim smartphone chargers, smartwatch battery connectors, and foldable device adapters.
  • IoT & Wearables: Flexible sensors, fitness tracker modules, and portable medical devices.
  • Automotive Systems: High-reliability connectors for车载充电器 (on-board chargers) and in-car infotainment systems.
  • Industrial Devices: Rugged adapters for industrial sensors and control systems in harsh environments.

Why Partner With Us?

  • Customization: Tailored ​trace widths (3μm–100μm), ​bend radii, and ​shielding configurations for specific application needs.
  • Cost-Effective Production: Lean manufacturing reduces prototyping costs by 30% with ​100% AOI/X-ray inspection for defect-free delivery.
  • Innovation: ​Nanoscale silver paste for low-resistance touch sensors and ​halogen-free materials for sustainability.

Elevate your adapter designs with double-sided flexible boards that combine flexibility, speed, and durability. Trust our expertise to deliver solutions that meet the demands of tomorrow’s advanced electronics!

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