Built with FR-4/Tg170 substrates or flexible PCBs for compact designs, these boards support multi-module parallel operations with **±0.02% FS voltage precision** and **<100dBm noise floor**, ideal for 800V EV platforms and high-capacity battery packs . Key features include CAN/LIN communication protocols for seamless integration with vehicle systems, AEC-Q100 certified components for automotive reliability, and EMI shielding to meet CISPR 25 standards . Certified to IPC-6012B Class 10 and CTI 175, our solutions address critical challenges such as thermal-structural coupling (max. 9.5μm Z-axis deformation) and hotspot temperature differences (up to 20.5°C) through advanced thermal management design .
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