Built with SiC (Silicon Carbide) substrates for high-efficiency power conversion (95%-96% efficiency, upgradable to 98% with SiC) and 0.1mm trace/space precision, these boards support multi-module parallel operations with **±0.02% FS voltage regulation** and **<10ms response time** . Key features include CAN bus communication for protocol compliance (GB/T 27930, ISO 15118), AEC-Q100 certified components for extreme temperature (-40°C to +125°C) and vibration resistance, and EMI shielding to meet CISPR 25 standards . Ideal for 800V EV platforms and high-power DC chargers (30kW-600kW), our solutions deliver **<100dBm noise floor** and **>90dB SNR**, ensuring seamless integration with GB/T 20234 connectors and V2G (Vehicle-to-Grid) communication protocols
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