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Aluminum substrate for suction base lamp PCBA

Parameter Table for Aluminum Substrate for Suction Base Lamp PCBA

Parameter Specifications
Substrate Material Aluminum core (e.g., 5052 or 6061 alloy) with dielectric insulation layer
Thickness 1.0–3.0 mm (adjustable for thermal and mechanical requirements)
Thermal Conductivity 1.0–3.0 W/m·K (effective heat dissipation for LED longevity)
Copper Layer Thickness 1–3 oz (35–105 µm) for circuit traces and current handling
Surface Finish HASL (Hot Air Solder Leveling) or OSP (Organic Solderability Preservative)
Operating Temperature -40°C to +105°C (stable performance under prolonged use)
Dielectric Strength ≥3 kV (ensures electrical insulation between aluminum core and circuitry)
Compliance Standards UL 94V-0 (flame retardant), RoHS, IPC-6012 (rigid PCB standards)
Applications Suction base lamps, LED downlights, high-brightness lighting systems

 

An ​Aluminum Substrate for Suction Base Lamp PCBA is a specialized printed circuit board assembly designed for high-efficiency LED lighting systems, combining superior thermal management with electrical reliability. Built on an ​aluminum core (5052/6061 alloy) and ​dielectric insulation layer, it efficiently dissipates heat (1.0–3.0 W/m·K) to prolong LED lifespan and prevent overheating. With ​1–3 oz copper traces, this substrate ensures stable current handling and supports high-power LED arrays while complying with ​UL 94V-0 and ​RoHS standards. Key applications include ​suction base lamps, commercial downlights, and architectural lighting, where its compact design, flame resistance, and ​**-40°C to +105°C** operating range make it ideal for residential and industrial environments. Manufacturers prioritize ​HASL/OSP finishes for solderability and corrosion resistance, ensuring durability in humid or high-temperature conditions.

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