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| PCBA Specification | Detail |
|---|---|
| Layer Count | 20-Layer High-Density HDI Design (Signal-Ground-Power ×10) |
| Min Line Width/Space | 3.5/3.5 MIL (0.089/0.089 mm) |
| Board Thickness | 2.40 mm ±10% (FR-4 TG170°C substrate) |
| Material | FR-4 TG170°C (Epoxy Glass Fiber with Tg ≥170°C, high thermal stability) |
| Outer Copper Thickness | 1 OZ (~35μm) |
| Inner Copper Thickness | HOZ (~17.5μm) |
| Solder Mask Color | Black (high precision, RoHS compliant) |
| Silk Screen Color | White |
| Molding Process | CNC + Stamping Hole (±0.05mm tolerance for complex profiling) |
| Surface Finish | OSP (Organic Solderability Preservatives) |
| Advanced Technology | High-Density HDI (via-in-pad technology for ultra-dense routing) |
