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| PCBA Specification | Detail |
|---|---|
| Layer Count | 14-Layer HDI Design (Signal-Ground-Power-Signal-Ground-Power ×7) |
| Min Line Width/Space | 4/3.5 MIL (0.102/0.089 mm) |
| Board Thickness | 2.00 mm ±10% (FR-4 TG170°C substrate) |
| Material | FR-4 TG170°C (Epoxy Glass Fiber with Tg ≥170°C, high thermal stability) |
| Outer Copper Thickness | 1 OZ (~35μm) |
| Inner Copper Thickness | 1 OZ (~35μm) |
| Solder Mask Color | Red (high precision, RoHS compliant) |
| Silk Screen Color | White |
| Molding Process | CNC + V-CUT (±0.05mm tolerance for complex profiling and edge cutting) |
| Surface Finish | Immersion Gold (~0.05μm thickness; RoHS compliant) |
| Advanced Technology | Resin Filled via in Pad (enhances thermal management and signal integrity) |
