Menu
This 12-layer communication PCB is engineered for high-performance, reliable operation in telecommunication systems, 5G infrastructure, and industrial networking equipment. With 3.5/3.5MIL minimum line/space, it supports high-density routing for advanced RF modules, processors, and high-speed data interfaces. Constructed on FR-4 (Tg 150°C), the board ensures thermal stability and durability under varying environmental conditions. The 1OZ copper layers (outer/inner) provide low resistance and efficient power delivery, while ENIG surface finish enhances solderability and prevents oxidation. Blue solder mask and white silkscreen improve component visibility and aesthetic appeal. CNC+V-CUT machining ensures precise assembly, ideal for compact, high-reliability communication devices.
| Parameter Category | Specification |
|---|---|
| Number of Layers | 12 Layer |
| Minimum Line/Space | 3.5/3.5 MIL |
| Board Thickness | 2.00 mm |
| Substrate Material | FR-4 (Tg 150°C) |
| Copper Thickness | 1OZ (Outer/Inner Layers) |
| Solder Mask Color | Blue |
| Silkscreen Color | White |
| Machining | CNC + V-CUT |
| Surface Finish | ENIG |
