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| PCBA Specification | Detail |
|---|---|
| Layer Count | 10-Layer HDI Design (Signal-Ground-Power-Signal-Ground-Power-Signal-Ground-Signal-Signal-Ground) |
| Min Line Width/Space | 3.5/3.5 MIL (0.089/0.089 mm) |
| Board Thickness | 1.60 mm ±10% (FR-4 TG170°C substrate) |
| Material | FR-4 TG170°C (Epoxy Glass Fiber with Tg ≥170°C, high thermal stability) |
| Outer Copper Thickness | 1 OZ (~35μm) |
| Inner Copper Thickness | 1 OZ (~35μm) |
| Solder Mask Color | Matte Black (high precision, cost-effective, and RoHS compliant) |
| Silk Screen Color | White |
| Molding Process | CNC + V-CUT (±0.05mm tolerance for complex profiling) |
| Surface Finish | Immersion Gold 2U” (~0.06μm thickness; RoHS compliant) |
| Advanced Technology | BGA 1st Order HDI (via-in-pad technology for high-density routing) |
