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This 10-layer medical device motherboard is engineered for precision, reliability, and compliance with stringent healthcare standards. Featuring 3.5/3.5MIL minimum line/space, it supports high-density routing for advanced medical electronics, such as imaging systems, patient monitors, and diagnostic devices. Built on FR-4 (Tg 170°C), the board ensures thermal stability and durability under extreme conditions. 1OZ copper layers (outer/inner) deliver low resistance and efficient power delivery, while gold plating (2μm) enhances corrosion resistance and biocompatibility. Matte green solder mask minimizes glare, paired with white silkscreen for clear component identification. CNC+V-CUT machining ensures precision, and BGA+via-in-pad technology optimizes space and signal integrity. Ideal for medical imaging, life support systems, and IoT-enabled healthcare devices requiring long-term reliability.
| Parameter Category | Specification |
|---|---|
| Number of Layers | 10 Layer |
| Minimum Line/Space | 3.5/3.5 MIL |
| Board Thickness | 1.60 mm |
| Substrate Material | FR-4 (Tg 170°C) |
| Copper Thickness | 1OZ (Outer/Inner Layers) |
| Solder Mask Color | Matte Green |
| Silkscreen Color | White |
| Machining | CNC + V-CUT |
| Surface Finish | Gold Plating (2μm) |
| Additional Tech | BGA + Via-in-Pad |
