Key Features:
- Advanced Impedance Control: Optimized for high-speed data transmission (e.g., PCIe, DDR4) with controlled impedance traces
- Surface Finish Excellence: ENIG immersion gold coating provides excellent solderability and corrosion resistance for lead-free assembly processes.
- Versatile Design Flexibility: Supports 0.25mil minimum hole size and 12:1 aspect ratio for complex interconnects (e.g., RF modules, server motherboards).
- Compliance & Reliability: Certified to IPC-2221 (mechanical properties) and UL 94 V-0 (flammability), ensuring safety and performance in critical applications.
Ideal Applications:
- Consumer Electronics: High-speed motherboards, network switches, and smart home devices requiring low signal loss and thermal stability.
- Industrial Systems: Control panels for robotic machinery, power inverters, and IoT gateways operating in harsh environments.
- Telecommunications: 5G base station components and satellite communication modules needing high-frequency performance.
Why Partner With Us?
- Customization: Tailored metal-based substrates (e.g., aluminum or copper) and impedance specifications for niche applications.
- Lean Manufacturing: 25% faster prototyping with 100% AOI/X-ray inspection for defect-free production.
- Global Reach: Compliant with RoHS 3.0 and REACH, ensuring seamless integration into international supply chains.
Elevate your electronic designs with 8-layer gold immersion plates that deliver precision, reliability, and innovation. Trust our expertise to power the future of technology!