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This 6-layer SSD finger card circuit board is designed for high-speed data transfer and reliable connectivity in storage devices, laptops, and industrial systems. With 3.5/3.5MIL minimum line/space, it supports precision routing for compact yet powerful SSD modules. Built on FR-4 (Tg 170°C), the board ensures thermal stability and durability under extreme operating conditions. The 1OZ copper layers (outer/inner) provide low resistance and efficient power delivery, while gold fingers (15U) and gold plating (2μm) enhance conductivity and oxidation resistance. Deep blue solder mask minimizes glare, paired with white silkscreen for clear component identification. CNC+V-CUT machining ensures precise shaping, and thick gold finger process guarantees long-term reliability for frequent insertion and removal in storage devices.
| Parameter Category | Specification |
|---|---|
| Number of Layers | 6 Layer |
| Minimum Line/Space | 3.5/3.5 MIL |
| Board Thickness | 1.60 mm |
| Substrate Material | FR-4 (Tg 170°C) |
| Copper Thickness | 1OZ (Outer/Inner Layers) |
| Solder Mask Color | Deep Blue |
| Silkscreen Color | White |
| Machining | CNC + V-CUT |
| Surface Finish | Gold Plating (2μm) + Gold Fingers (15U) |
| Additional Tech | Thick Gold Finger Process |
