Key Features:
- Advanced Layer Stack: Customizable layer configurations (e.g., 4 rigid + 2 flex) optimize routing density and mechanical strength
- High-Frequency Performance: Impedance-controlled traces (50Ω differential pairs) ensure signal integrity for PCIe 5.0 and 5G RF applications
- Thermal Management: Thermal vias and graphene-enhanced substrates dissipate heat generated by high-current components (e.g., AI chips, 108MP cameras)
- Durability: **≥100k flex cycles** (PI-based flex regions) withstand repeated bending in wearable devices and hinged electronics
- Manufacturing Precision: Automated Optical Inspection (AOI) and laser drilling ensure zero defects in micro-via and fine-pitch solder mask applications
Ideal Applications:
- Consumer Electronics: Foldable smartphones, smartwatches, and AR/VR headsets with ultra-slim profiles
- Aerospace & Defense: High-reliability systems for avionics, satellites, and military-grade sensors
- Medical Devices: Implantable devices, diagnostic equipment, and flexible ECG electrodes requiring biocompatibility and sterilization resistance
- Industrial Automation: Rugged interconnects for vibration-prone machinery and control systems
Why Partner With Us?
- Customization: Tailored layer counts, trace widths (3μm–100μm), and shielding configurations for specific application needs.
- Cost-Effective Production: Lean manufacturing reduces lead times by 25% with 100% AOI/X-ray inspection for defect-free delivery
- Innovation: Leading-edge nanoscale silver paste for low-resistance touch sensors and halogen-free materials for sustainability
Elevate your product designs with 6 Layer Rigid-Flex PCBs that balance flexibility, performance, and reliability. Trust our expertise to deliver solutions that meet the demands of tomorrow’s advanced electronics!