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This 6-layer audio device motherboard is designed for high-performance sound processing and signal integrity in premium audio systems, home theaters, and professional recording equipment. With 4/4MIL minimum line/space, it supports dense routing for advanced audio components while maintaining a slim 1.20 mm board thickness. Built on FR-4 (Tg 150°C), the board ensures thermal stability and durability under continuous operation. The 1OZ copper layers (outer/inner) deliver low resistance and efficient power delivery, crucial for high-fidelity audio output. Gold plating (1μm) enhances corrosion resistance, while BGA via-in-pad technology improves signal integrity and reduces electromagnetic interference (EMI).哑黑色阻焊 (matte black solder mask) minimizes glare for aesthetic appeal, paired with white silkscreen for clear component labeling. CNC machining ensures precision in shaping, making it ideal for compact yet powerful audio devices.
| Parameter Category | Specification |
|---|---|
| Number of Layers | 6 Layer |
| Minimum Line/Space | 4/4 MIL |
| Board Thickness | 1.20 mm |
| Substrate Material | FR-4 (Tg 150°C) |
| Copper Thickness | 1OZ (Outer/Inner Layers) |
| Solder Mask Color | Matte Black |
| Silkscreen Color | White |
| Machining | CNC |
| Surface Finish | Gold Plating (1μm) |
| Additional Tech | BGA Via-in-Pad |
