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This 4-layer smart home circuit board is engineered for compact, high-performance, and reliable operation in home automation systems, IoT devices, and smart appliances. With 4/4MIL minimum line/space, it supports precise routing for complex circuit designs while maintaining a 1.60 mm board thickness. Built on FR-4 (Tg 150°C), the board offers excellent thermal stability and durability, ideal for environments with varying temperature conditions. The 1OZ copper layers (outer/inner) ensure low resistance and efficient power delivery, while gold plating (1μm) prevents oxidation and extends component lifespan. The green solder mask and white silkscreen enhance component identification, and metal edge-banding provides structural reinforcement and EMI shielding. CNC machining ensures high-precision shaping for seamless integration into smart home devices.
| Parameter Category | Specification |
|---|---|
| Number of Layers | 4 Layer |
| Minimum Line/Space | 4/4 MIL |
| Board Thickness | 1.60 mm |
| Substrate Material | FR-4 (Tg 150°C) |
| Copper Thickness | 1OZ (Outer/Inner Layers) |
| Solder Mask Color | Green |
| Silkscreen Color | White |
| Machining | CNC |
| Surface Finish | Gold Plating (1μm) |
| Additional Tech | Metal Edge-Banding |
