Menu
This 4-layer Bluetooth earpiece circuit board is designed for compact, high-performance audio and wireless communication applications. With 4/3.6MIL minimum line/space and 1OZ copper layers (outer/inner), it ensures precise routing and exceptional signal integrity for seamless Bluetooth connectivity. Built on FR-4 (Tg 150°C), the board offers thermal stability and durability for demanding portable devices. The gold plating (1μm) surface finish prevents oxidation, while blue solder mask and white silkscreen enhance visual clarity and component identification. CNC+V-CUT machining and blind vias enable efficient assembly and miniaturization. Ideal for wireless earbuds, Bluetooth headsets, and IoT audio devices requiring compact size and reliable performance.
| Parameter Category | Specification |
|---|---|
| Number of Layers | 4 Layer |
| Minimum Line/Space | 4/3.6 MIL |
| Board Thickness | 1.20 mm |
| Substrate Material | FR-4 (Tg 150°C) |
| Copper Thickness | 1OZ (Outer/Inner Layers) |
| Solder Mask Color | Blue |
| Silkscreen Color | White |
| Machining | CNC + V-CUT |
| Surface Finish | Gold Plating (1μm) |
| Additional Tech | Blind Viases |
