Layer Count |
2 Layers |
Min Line Width/Space |
5/5 MIL (0.127/0.127 mm) |
Board Thickness |
1.60 mm ±10% (Tolerance as per IPC-2221 standards for FR4 TG140 materials) |
Material |
FR-4 TG140 (Epoxy Glass Fiber with Tg ≥140°C) |
Outer Copper Thickness |
1 OZ (equivalent to ~35μm) |
Inner Copper Thickness |
– (Not applicable for 2-layer design) |
Solder Mask Color |
Green |
Silk Screen Color |
White |
Molding Process |
CNC (Tolerance: ±0.05mm for high-precision profiling) |
Surface Finish |
Lead-Free HASL (Hot Air Solder Leveling) |