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This 2-layer thick copper power PCB is designed for high-current density applications, such as power supplies, motor drivers, and industrial inverters. With 10/10MIL minimum line/space, it supports robust routing for high-power components while maintaining thermal efficiency. Constructed on FR-4 (Tg 140°C), the board ensures dimensional stability under heat and mechanical stress. The 3OZ outer copper layers provide exceptional conductivity and heat dissipation, critical for high-load operations. Green solder mask and white silkscreen enhance component visibility and aesthetics. CNC machining ensures precision, and lead-free tin plating complies with RoHS standards for eco-friendly performance.
| Parameter Category | Specification |
|---|---|
| Number of Layers | 2 Layer |
| Minimum Line/Space | 10/10 MIL |
| Board Thickness | 1.60 mm |
| Substrate Material | FR-4 (Tg 140°C) |
| Copper Thickness | 3OZ (Outer Layer), Not Applicable (Inner Layer) |
| Solder Mask Color | Green |
| Silkscreen Color | White |
| Machining | CNC |
| Surface Finish | Lead-Free Tin Plating |
