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This 6-layer drone mainboard PCB is engineered for high-performance, reliable operation in unmanned aerial vehicles (UAVs), offering advanced features tailored for complex avionics systems. With 3.5/3.5MIL minimum line/space, it supports high-density routing for integrated circuits and sensors, while maintaining a 1.60 mm board thickness for structural integrity. Built on FR-4 (Tg 170°C), the board withstands extreme thermal cycling and vibration, ensuring durability in harsh environments. The 1OZ copper layers (outer/inner) provide low resistance and efficient power delivery, critical for motor control and data transmission. Gold plating (2μm) prevents oxidation and extends component lifespan, while matte black solder mask minimizes glare for clear component identification. CNC+stamping holes enable precise assembly, and mechanical buried blind vias + PTH half-hole technology optimize space utilization and signal integrity. Ideal for industrial drones, racing quadcopters, and autonomous aerial systems requiring compact, high-reliability PCBs.
| Parameter Category | Specification |
|---|---|
| Number of Layers | 6 Layer |
| Minimum Line/Space | 3.5/3.5 MIL |
| Board Thickness | 1.60 mm |
| Substrate Material | FR-4 (Tg 170°C) |
| Copper Thickness | 1OZ (Outer/Inner Layers) |
| Solder Mask Color | Matte Black |
| Silkscreen Color | White |
| Machining | CNC + Stamping Holes |
| Surface Finish | Gold Plating (2μm) |
| Additional Tech | Mechanical Buried Blind Vias + PTH Half-Hole |
