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3OZ Thick Copper Coil Plate PCBA

Parameter Table for 3OZ Thick Copper Coil Plate PCBA

Parameter Specifications
Copper Thickness 3 oz (105 µm) for enhanced current capacity and heat dissipation
PCB Thickness 2.0–4.0 mm (adjustable based on mechanical and thermal requirements)
Substrate Material FR4 (high-Tg), polyimide, or metal-core (aluminum) for thermal stability
Layer Count 1–8 layers (single-sided to multi-layer for complex coil and power routing)
Coil Design Planar/embedded coils for inductors, transformers, and high-frequency circuits
Current Capacity 15–20A/mm² (suitable for high-power applications)
Surface Finish ENIG (Electroless Nickel Immersion Gold) or HASL (Hot Air Solder Leveling)
Thermal Management Thermal vias, heatsinks, and resin-filled via holes for heat dissipation
Operating Temperature -40°C to +125°C (industrial-grade reliability)
Compliance Standards IPC-6012 Class 3, UL 94V-0 (flame retardant), RoHS, ISO 9001
Applications Power supplies, EV charging modules, solar inverters, RF amplifiers

 

A ​3OZ Thick Copper Coil Plate PCBA is a specialized printed circuit board assembly designed for ​high-current and high-frequency applications, such as power converters, RF systems, and electric vehicle (EV) charging modules. Featuring ​3 oz (105 µm) copper layers, it delivers superior current-carrying capacity (15–20A/mm²) and minimizes resistive losses in planar or embedded coil designs. Built on ​high-Tg FR4 or ​metal-core substrates, this PCBA ensures mechanical stability and efficient heat dissipation under extreme temperatures (-40°C to +125°C). Key manufacturing techniques include ​resin-filled vias and ​thermal vias to enhance thermal performance, while ​ENIG surface finish ensures corrosion-resistant solder joints. Compliant with ​IPC-6012 Class 3 and ​RoHS, it is ideal for renewable energy systems, industrial motor drives, and telecom infrastructure, offering reliability in harsh environments and high-power-density designs.

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