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4.0mm Ultra Thick Coil Plate PCBA

Parameter Table for 4.0mm Ultra Thick Coil Plate PCBA

Parameter Specifications
PCB Thickness 4.0 mm (ultra-thick for structural rigidity and thermal mass)
Copper Weight 4 oz (140 µm) or higher for high-current coil windings and low resistive losses
Substrate Material High-Tg FR4 (e.g., S1000-2M) or metal-core (aluminum) for thermal dissipation
Layer Count 6–14 layers (multi-layered with buried vias for dense power/signal routing)
Coil Design Embedded planar coils for inductive applications (transformers, chokes)
Thermal Management Resin-filled vias, thermal pads, and integrated heatsinks for >20A/mm² current
Surface Finish ENIG (Electroless Nickel Immersion Gold) or Immersion Silver for solderability
Operating Temperature -40°C to +150°C (industrial-grade stability under thermal cycling)
Compliance Standards IPC-6012 Class 3, UL 94V-0, RoHS, IATF 16949 (automotive)
Applications EV power inverters, high-frequency transformers, industrial motor drives, renewable energy systems

 

A ​4.0mm Ultra Thick Coil Plate PCBA is a robust printed circuit board assembly engineered for ​high-power inductive applications, combining ultra-thick 4.0mm substrates with ​4 oz (140 µm) copper layers to handle extreme currents (>20A/mm²) and minimize resistive losses. Designed for industries like electric vehicles (EVs) and renewable energy, it integrates ​planar coil windings for transformers and chokes, achieving high efficiency in power conversion and motor control. The multi-layer FR4 or metal-core construction ensures mechanical stability and thermal dissipation, while ​ENIG surface finish guarantees corrosion-resistant solder joints. Compliant with ​IPC-6012 Class 3 and ​IATF 16949, this PCBA operates reliably in harsh environments (-40°C to +150°C) and supports advanced manufacturing techniques like ​resin-filled vias and ​sequential lamination to prevent delamination. Applications include EV inverters, solar microinverters, and industrial automation systems, delivering unmatched performance in high-voltage, high-frequency scenarios.

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