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4OZ thick copper coil board PCBA

Parameter Table for 4OZ Thick Copper Coil Board PCBA

Parameter Specifications
Copper Thickness 4 oz (140 µm) for high-current handling and reduced resistive losses
Layer Count Up to 10 layers (multi-layered with buried vias for dense interconnects)
Substrate Material High-Tg FR4 (S1000-2M) for thermal stability (Tg ≥ 170°C)
Via Technology Buried vias with controlled-depth drilling and sequential lamination
Thermal Management Resin-filled vias and multi-stage lamination to enhance heat dissipation
Current Capacity Supports >20A/mm² for applications like EV motors and power converters
Surface Finish ENIG (Electroless Nickel Immersion Gold) or OSP for corrosion resistance
Compliance Standards IPC-6012 (rigid PCB standards), UL 94V-0 (flame retardant), RoHS
Applications EV charging systems, industrial power supplies, solar inverters, motor drives

 

A ​4OZ Thick Copper Coil Board PCBA is a high-performance printed circuit board assembly designed for ​high-power, high-frequency applications requiring exceptional current capacity and thermal efficiency. Utilizing ​4 oz (140 µm) copper layers, this PCBA minimizes resistive losses and supports currents exceeding ​20A/mm², ideal for electric vehicle (EV) motor controllers and renewable energy systems. The multi-layer structure (up to 10 layers) incorporates ​buried vias and sequential lamination to achieve dense interconnects while maintaining mechanical integrity under thermal stress. Built on ​high-Tg FR4 substrates (e.g., Shengyi S1000-2M), it ensures stability in harsh environments (-40°C to +125°C) and complies with ​IPC-6012 and ​RoHS standards. Key manufacturing steps include ​controlled-depth drilling, ​resin-filled via encapsulation, and ​multi-stage lamination to prevent delamination and ensure reliability. Applications span industrial power converters, smart grid modules, and aerospace systems, emphasizing compact designs and scalable production for next-generation energy solutions.

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