PCB & PCBA
Manufacturing Services

PCBA

Parameter Table for PCBA

Parameter Specifications
Manufacturing Process SMT (Surface Mount Technology), PTH (Pin Through Hole), Reflow/Wave Soldering
Substrate Material FR4 (standard), High-Tg FR4, or metal-core (aluminum) for thermal management
Layer Count 1–12 layers (depending on circuit complexity and application)
Copper Weight 1–3 oz (35–105 µm) for signal integrity and current capacity
Surface Finish HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), or OSP
Component Types Resistors, capacitors, ICs (AEC-Q100 for automotive), inductors, connectors
Inspection Methods SPI (Solder Paste Inspection), AOI (Automated Optical Inspection), X-ray testing
Operating Temperature -40°C to +150°C (industrial-grade with high-Tg materials)
Compliance Standards IPC-A-610 (assembly quality), ISO 9001, RoHS, UL certification
Applications Consumer electronics, automotive ECUs, IoT devices, medical equipment

 

PCBA (Printed Circuit Board Assembly) refers to the complete process of mounting and soldering electronic components onto a PCB, transforming it into a functional unit. It involves ​SMT for surface-mount components (e.g., ICs, resistors) and ​PTH for through-hole parts (e.g., connectors), followed by ​reflow or wave soldering to ensure robust electrical connections . Key materials include ​FR4 substrates for durability and ​ENIG/HASL finishes for corrosion resistance, supporting applications in automotive, industrial, and consumer electronics . Advanced inspection techniques like ​AOI and ​SPI validate solder quality and component alignment, adhering to ​IPC-A-610 Class 3 standards for high-reliability systems . With compliance to ​RoHS and ​UL safety certifications, PCBA is critical in manufacturing smart devices, medical tools, and EV control modules, emphasizing precision and scalability.

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