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Thickness 3mm copper 3OZ transformer plate PCBA

Parameter Table for Thickness 3mm Copper 3OZ Transformer Plate PCBA

Parameter Description
PCB Thickness 3.0 mm (FR4 substrate with high mechanical strength and thermal stability)
Copper Weight 3 oz (105 µm) inner/outer layers for high-current handling and heat dissipation
Layer Count 2–12 layers (multi-layer designs for complex transformer/inductor circuits)
Applications High-frequency transformers, power converters, motor drives, EV charging systems
Surface Finish ENIG (Electroless Nickel Immersion Gold) or HASL for solderability and corrosion resistance
Dielectric Material FR4, Rogers 4350B, or polyimide for high-frequency/high-temperature performance
Voltage Rating Up to 1000V AC/DC (creepage/clearance compliant with IEC 60664)
Thermal Conductivity 0.3–1.5 W/m·K (enhanced with embedded thermal vias or metal-core substrates)
Operating Temperature -40°C to +150°C (high-Tg materials for harsh environments)
Compliance Standards IPC-2221 (power device design), UL 94V-0 (flame resistance), RoHS

 

A ​Thickness 3mm Copper 3OZ Transformer Plate PCBA is a heavy-duty printed circuit board assembly engineered for ​high-power, high-frequency applications such as industrial power supplies, electric vehicle (EV) chargers, and renewable energy systems. Built on a ​3mm FR4 substrate with ​3 oz (105 µm) copper layers, it delivers exceptional current-carrying capacity (up to ​20A/mm²) and heat dissipation, critical for transformer and inductor circuits. The multi-layer design (up to 12 layers) supports complex topologies like LLC resonant converters, while ​ENIG surface finish ensures reliable solder joints and corrosion resistance. Compliant with ​IPC-2221 and ​UL 94V-0 standards, this PCBA operates in extreme temperatures (-40°C to +150°C) and integrates thermal vias or metal-core substrates to manage thermal loads. Applications include solar inverters, motor drives, and telecom power systems, where durability and signal integrity are paramount.

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