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This 4-layer inverter power PCB is designed for high-power density applications, such as solar inverters, industrial motor drives, and uninterruptible power supplies (UPS). With 6/6MIL minimum line/space, it supports robust routing for high-current circuits while maintaining thermal efficiency. Built on FR-4 (Tg 170°C), the board ensures exceptional thermal stability and mechanical strength under extreme operating conditions. The 2OZ copper layers (outer/inner) provide ultra-low resistance and efficient heat dissipation, critical for high-load inverters. Green solder mask and white silkscreen enhance component visibility, while CNC+V-CUT machining ensures precision for reliable assembly. Lead-free tin plating complies with RoHS/WEEE standards for eco-friendly performance.
| Parameter Category | Specification |
|---|---|
| Number of Layers | 4 Layer |
| Minimum Line/Space | 6/6 MIL |
| Board Thickness | 1.20 mm |
| Substrate Material | FR-4 (Tg 170°C) |
| Copper Thickness | 2OZ (Outer/Inner Layers) |
| Solder Mask Color | Green |
| Silkscreen Color | White |
| Machining | CNC + V-CUT |
| Surface Finish | Lead-Free Tin Plating |
