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This 4-layer inverter power circuit board is engineered for high-density power conversion applications. With 7/7MIL minimum line/space, it supports advanced routing precision for compact designs. Constructed on FR-4 (Tg 140°C) with 2OZ copper layers (outer/inner), it ensures superior conductivity, heat dissipation, and thermal stability. The board features multi-PTH slots for enhanced connectivity and reliability, paired with lead-free tin plating (RoHS/WEEE compliant). CNC+V-CUT shaping and green solder mask with white silkscreen make it ideal for inverters, uninterruptible power supplies (UPS), and industrial automation systems.
| Parameter Category | Specification |
|---|---|
| Number of Layers | 4 Layer |
| Minimum Line/Space | 7/7 MIL |
| Board Thickness | 1.60 mm |
| Substrate Material | FR-4 (Tg 140°C) |
| Copper Thickness | 2OZ (Outer/Inner Layers) |
| Solder Mask Color | Green |
| Silkscreen Color | White |
| Machining | CNC + V-CUT |
| Surface Finish | Lead-Free Tin Plating |
| Additional Tech | Multi-PTH Slots |
