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Semi-automatic stencil printing machine

Parameter Table for Semi-Automatic Stencil Printing Machine

Parameter Specifications
PCB Size 250×400 mm to 1200×350 mm (supports single/double-sided boards)
Printing Speed 0–8000 mm/min (adjustable via touchscreen)
Accuracy ±0.05 mm (micron-level alignment)
Repeatability ±0.01 mm (high-precision servo motors)
Stencil Compatibility 370×470 mm to 550×650 mm (expandable to 1500×650 mm for custom needs)
Power Supply 220V AC, single-phase, 50/60 Hz
Air Pressure 4.5–6 kgf/cm² (pneumatic systems)
PCB Thickness 0.2–6 mm (flexible/rigid board support)
Control System PLC-based touchscreen (e.g., Panasonic/Siemens)
Cycle Time <9–15 seconds (model-dependent)
Weight 250–420 kg (compact footprint: 0.8–1.75m length)

 

A ​Semi-Automatic Stencil Printing Machine is a cost-effective, precision tool for applying solder paste onto PCBs in ​SMT (Surface Mount Technology) manufacturing. Designed for mid-volume production and prototyping, it supports PCB sizes up to ​1200×350 mm and achieves micron-level accuracy (±0.05 mm) with ±0.01 mm repeatability. Key features include ​PLC-controlled touchscreens for programmable workflows, ​adjustable printing speeds (0–8000 mm/min), and compatibility with single/double-sided boards. Models like the ​P12 and ​JW-818 integrate ​high-precision linear rails and modular platforms for quick stencil changes, reducing setup time and material waste. Widely used in automotive, consumer electronics, and IoT industries, these machines ensure compliance with ​IPC standards and support lead-free soldering for RoHS-compliant workflows. Their compact design and nitrogen-ready options make them ideal for flexible, high-mix production lines

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