A Semi-Automatic Solder Paste Printing Machine is a precision tool used in SMT (Surface Mount Technology) manufacturing to apply solder paste onto PCBs with micron-level accuracy (±0.02 mm). Designed for flexibility and cost-efficiency, it supports PCB sizes up to 1200×300 mm and integrates PLC-controlled touchscreens (e.g., Siemens or Panasonic) for programmable workflow. Key features include adjustable printing speeds (0–8000 mm/min), manual/auto stencil alignment, and compatibility with double-sided boards and miniaturized components like 01005 packages. These machines are ideal for automotive, consumer electronics, and IoT production, ensuring compliance with IPC standards while reducing setup time and material waste. Models such as the JW-818 and P12 emphasize durability with imported linear rails and high-flow pneumatic systems, making them suitable for both prototyping and mid-volume runs
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