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High-speed Multi-function Mounter

Parameter Table for High-speed Multi-function Mounter

Parameter Description
Placement Speed 80,000–150,000 CPH (components per hour)
Placement Accuracy ±0.025–0.04 mm (micron-level precision)
Component Range 01005 (0.25×0.125 mm) to 55×55 mm (e.g., QFN, BGA, connectors, odd-form parts)
Feeder Capacity 120–300 slots (supports tape, tray, tube, and bulk feeders)
Vision System 3D laser alignment + high-resolution RGB cameras (15–25 µm/pixel)
Control Software AI-driven optimization, CAD/CAM integration, real-time defect detection
Power Supply 200–480V AC, 3-phase (10–30 kW)
Machine Footprint 2.5m × 1.8m × 1.5m (compact modular design for flexible line integration)
Compliance Standards IPC-9850, ISO 9001, IEC 62321 (RoHS-compliant processes)
Automation Features Dual-lane operation, auto-feeder calibration, robotic part handling
Cooling System Liquid-cooled spindles for thermal stability during high-speed operation

 

A ​High-speed Multi-function Mounter is an advanced SMT (Surface Mount Technology) machine designed for ultra-efficient, precision placement of electronic components onto PCBs in high-volume manufacturing. Combining speeds of ​80,000–150,000 components per hour (CPH) with micron-level accuracy (±0.025 mm), it handles miniature parts like ​01005 chips and large components such as ​BGA packages or connectors. Key innovations include ​AI-driven vision systems (3D laser + RGB cameras) for defect-free alignment, dual-lane processing for parallel workflows, and compatibility with tape, tray, and bulk feeders. Ideal for automotive electronics, 5G devices, and IoT hardware, this mounter ensures compliance with ​IPC-9850 and ​RoHS standards while reducing cycle times and material waste. Its modular design supports Industry 4.0 integration, enabling real-time data exchange and predictive maintenance for smart factory environments.

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