Compliant with IPC-9850 and RoHS, reflow soldering is essential for automotive electronics, consumer devices, and aerospace applications, balancing efficiency with stringent quality standards.
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| Parameter | Description |
|---|---|
| Temperature Range | 50–300°C (multi-zone thermal profiling) |
| Heating Zones | 5–14 zones (including preheating, soaking, reflow, and cooling stages) |
| Heating Technology | Infrared (IR), forced convection (hot air), hybrid (IR + hot air), or vapor phase systems |
| Cooling Rate | 2–6°C/sec (enhanced by high-flow fans or liquid-cooled systems) |
| Conveyor Speed | 0.1–1.5 m/min (adjustable for PCB thickness and component sensitivity) |
| Nitrogen Inerting | Optional O₂ levels <500 ppm to reduce oxidation and improve solder joint quality |
| Power Supply | 220–480V AC, 3-phase (20–60 kW) |
| PCB Compatibility | Supports 50×50 mm to 510×460 mm PCBs, including flexible and rigid boards |
| Control System | PLC-based automation with AI-driven thermal profiling (e.g., KIC software) |
| Compliance Standards | IPC-9850, ISO 9001, RoHS, and IEC 62321 |
Compliant with IPC-9850 and RoHS, reflow soldering is essential for automotive electronics, consumer devices, and aerospace applications, balancing efficiency with stringent quality standards.