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Automatic Optical Tester

Parameter Table for Automatic Optical Tester

Parameter Description
Model VL Series (e.g., VL-200, VL-500) for semiconductor packaging
Detection Technology 3D light field imaging with line-scan capabilities
Detection Accuracy Sub-micron level (e.g., ±0.1 µm for bumping processes)
Detection Speed Up to 20,000 units per hour (UPH)
Compatibility Wire-bonding (Au/Cu wires), BGA, Flip-Chip, CSP packaging
Key Defects Detected Wire bonding: ball overlap, missing wires, chip contamination; Bumping: ball misalignment, size deviations
Data Interface RS-232, USB, Ethernet for QA/QC platform integration
Light Source Adjustable LED arrays (RGB/IR) for optimized illumination
Software Integration AI-driven defect recognition with CAD/CAM compatibility
Output Formats 3D point cloud images, CSV/PDF defect reports
Protection Grade IP54 (dust and splash resistance)
Dimensions Compact modular design for inline integration (e.g., 600mm × 800mm × 1200mm)
Power Supply 100–240V AC, 50/60Hz

 

An ​Automatic Optical Tester (AOT) is a high-precision inspection system designed for ​semiconductor packaging and ​electronics manufacturing, utilizing advanced ​3D light field imaging and ​AI-driven defect detection to ensure product quality. It specializes in identifying critical defects in wire-bonding (e.g., ball misalignment, broken wires) and bumping processes (e.g., solder ball size deviations, planar misplacement) with sub-micron accuracy (±0.1 µm). Capable of scanning up to ​20,000 units per hour, the VL Series line-scan models combine ​anti-occlusion capabilities and ​depth-aware 3D reconstruction to overcome limitations of traditional 2D AOI systems. Integrated with QA/QC platforms via USB/Ethernet interfaces, it generates actionable reports (CSV/PDF) and supports real-time adjustments in smart factories. Applications span automotive electronics, consumer devices, and advanced packaging (BGA, Flip-Chip), aligning with ISO and semiconductor industry standards for defect-free production

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