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| Parameter | Specification |
|---|---|
| Material | Polyimide (PI) or PET substrates for flexibility and durability |
| Thickness | 0.1mm–0.3mm (standard) / 0.05mm ultra-thin for miniaturized modules |
| Conductivity | Copper traces with **≤0.1Ω/sq** resistance (high-current paths) |
| Layer Configuration | Single-sided (simple modules) to 8-layer (complex RF/Power modules) |
| Pitch & Design | 0.15mm–0.4mm pitch for BGA/FPC connectors; micro-pad designs for precision |
| Temperature Range | **-55°C to +125°C** (operational); **+260°C** short-term tolerance (PI-based) |
| Flex Life | **≥100k flex cycles** (PI) / **≥50k cycles** (PET) for reliable dynamic use |
| Signal Integrity | Impedance-controlled traces (100Ω differential pairs for DDR4/5 signals) |
| EMI Shielding | Copper foils or conductive inks for GHz-range interference protection |
| Current Rating | Up to 5A per trace (for power modules) / 1.5A (signal lines) |
| Surface Finish | ENIG (gold plating) for corrosion resistance; HASL for cost-sensitive designs |
| Testing Standards | IPC-6012B (quality), IEC 62153 (EMC), MIL-STD-883J (reliability) |
| Module Types | BGA, FPC-to-FPC, Edge Card Connectors (e.g., PoE modules) |
