Key Features:
- Space-Saving Design: Reduce module size by 50% compared to rigid PCBs, ideal for foldable electronics and compact IoT endpoints.
- Reliability: **≥100k flex cycles** (PI) for dynamic applications like rotating joints or hinged modules.
- High-Speed Signal Handling: Impedance-controlled traces (100Ω differential pairs) ensure seamless data transfer for DDR4/5, PCIe 4.0, and 5G RF signals.
- Power Efficiency: Up to 5A current per trace for motor drives, LEDs, or power management ICs with minimal heat generation.
- Shielding & Compliance: Copper foil shielding blocks EMI/RFI interference, while certifications (IPC-6012B, IEC 62153) guarantee global market readiness.
Ideal Applications:
- IoT & Wearables: Smartwatches, fitness trackers, and environmental sensors with wireless charging coils.
- Medical Devices: Flexible ECG electrodes, implantable sensors, and portable ultrasound probes.
- Automotive Systems: Seat sensors, airbag controllers, and flexible displays in automotive interiors.
- Renewable Energy: Solar panel connectors and battery management systems for EVs.
Why Choose Our Module FPCs?
- Customization: Tailored layer counts (1–8 layers), trace widths (3μm–100μm), and connector types (BGA, FPC, edge-mount).
- Cost-Effective Manufacturing: Automated Optical Inspection (AOI) and lean production reduce defects by 95%.
- Innovation: Graphene-enhanced substrates for next-gen thermal management and halogen-free materials for sustainability.
Elevate your modular designs with FPCs that combine flexibility, speed, and durability. Partner with us to create compact, reliable, and future-proof solutions for tomorrow’s markets!