Key Features:
- Ultra-Fast Data Transmission: 1.27mm-pitch connectors and micro-via technology enable high-density routing for PCIe 5.0 and DDR5 memory interfaces with **<10dB insertion loss** at 24GHz
- Durability: 300+ mating cycles for frequent reconfigurations and 10-year lifespan under extreme temperatures
- Thermal Management: Optimized thermal vias and ENIG surface finish prevent overheating during high-load operations
- Compliance & Quality: Certified to IPC-6012B and MIL-STD-883, ensuring zero defects with 100% automated optical inspection (AOI)
Ideal Applications:
- Servers & Data Centers: Powering high-speed networking and storage solutions.
- Industrial Automation: Reliable connections in harsh environments (e.g., factory control systems).
- 5G Infrastructure: High-frequency signal routing for base stations and networking equipment.
Why Partner With Us?
- Customization: Tailored layer counts (2–8 layers), trace widths (3μm–100μm), and shielding configurations.
- Cost-Effective Production: Lean manufacturing reduces lead times by 25% while maintaining top-tier quality
- Innovation: Leading-edge graphene-enhanced substrates for next-gen heat dissipation and signal speed.
Elevate your computing systems with high-performance, durable, and future-proof connection boards. Trust our expertise to deliver solutions that balance speed, power, and reliability.