Key Advantages:
- Space-Saving: Reduce device volume by 70% compared to rigid PCBs, ideal for compact designs like foldable screens and multi-camera setups
- High-Performance: Support up to 3A current for power-hungry components (e.g., fingerprint sensors) and withstand extreme temperatures (-40°C to +105°C)
- Versatile Applications:
- Camera Modules: Connect CMOS sensors to the motherboard with precision, ensuring clear images
- Battery & Antenna Systems: Handle frequent bending and 5G antenna integration
- Foldable Devices: Enable hundreds of flex cycles without failure
- Camera Modules: Connect CMOS sensors to the motherboard with precision, ensuring clear images
Design Considerations:
- Layered Configurations: Single/multi-layer options for simple to complex circuits
- Thermal Management: Optimized for heat dissipation to prevent performance degradation
- Testing Rigor: Mandatory checks for shorts/opens, trace integrity, and mechanical durability to ensure high yield
Choose FPCs for your mobile devices to achieve innovative designs, enhanced functionality, and cost-effective manufacturing