Key Features:
- Ultra-Fast Data Transmission: Impedance-controlled traces (100Ω DDR4/5, 50Ω RF) ensure seamless 5G mmWave and PCIe 4.0 connectivity with **<10dB insertion loss** at 24GHz.
- Power Efficiency: High-current copper traces (up to 5A) handle 108MP camera modules, AI chips, and fast-charging systems while minimizing heat generation.
- Compact Design: Micro-via technology and 0.2mm-pitch BGA connectors save 30% space compared to traditional designs, ideal for slim phones.
- Durability: Built to withstand 100k+ flex cycles (for hinged devices) and 10-year lifespan under extreme conditions (-40°C to +125°C).
- Advanced Shielding: Copper foils and conductive inks block EMI/RFI interference, ensuring reliable performance in crowded wireless environments.
Ideal Applications:
- Flagship Smartphones: Powering 108MP cameras, AI processors, and ultra-thin designs (e.g., iPhone 15 Pro-class devices).
- 5G Modems: High-frequency signal routing for sub-6GHz and mmWave bands with low insertion loss.
- Foldable & Rollable Devices: Rigid-flex hybrids that endure repeated bending without trace cracking or solder joint failure.
- Cost-Effective Mass Production: Lean manufacturing reduces lead times by 25% with 100% AOI/X-ray inspection for zero defects.
Why Partner With Us?
- Customization: Tailored layer counts (2–8 layers), trace widths (3μm–100μm), and shielding configurations.
- Compliance: Certified to IPC-6012B, ISO 13485, and RoHS 3.0 for global market access.
- Innovation: Leading-edge thermal vias and graphene-enhanced substrates for next-gen heat dissipation.
Upgrade your mobile device designs with precision-engineered boards that balance speed, power, and durability. Trust our expertise to bring your flagship smartphone concepts to life!