Key Features:
- Compact Design: 0.2mm-thin profiles save space in slim devices, while rigid-flex hybrids support seamless integration into hinged折叠屏 structures.
- Performance Excellence:
- High-Speed Connectivity: Supports DDR4/5 memory interfaces and PCIe 4.0 signals with **<10dB insertion loss** at 24GHz.
- Power Efficiency: Low-loss copper routing reduces energy consumption for battery-intensive features (e.g., 108MP cameras, AI chips).
- Durability:
- Gold-plated contacts resist corrosion for >10k mating cycles.
- Thermal vias dissipate heat efficiently, preventing overheating during gaming or video calls.
- Manufacturing Precision:
- Micro-stamp pads enable accurate soldering for BGA/FPC connectors.
- 100% automated optical inspection (AOI) ensures zero shorts/opens.
Ideal Applications:
- Smartphones: Powering flagship models with 108MP cameras, AI processors, and ultra-fast charging systems.
- Foldable Devices: Rugged interconnects that endure 50k+ flex cycles for durable hinge mechanisms.
- 5G Modems: High-frequency signal routing for sub-6GHz and mmWave bands.
Why Choose Our Connection Boards?
- Cost-Effective Mass Production: Lean manufacturing processes reduce lead times by 30%.
- Customization: Tailored layer counts, trace widths (as low as 3μm), and shielding configurations.
- Compliance: Certified to IPC-6012B, ISO 13485, and RoHS 3.0 for global market access.
Elevate your mobile device designs with precision, performance, and reliability—partner with us for next-gen connection boards!