FPC

Product Parameters and Descriptions for FPC (Flexible Printed Circuit)
1. Key Product Parameters

​Material: Base substrates typically use Polyimide (PI) or Polyester (PET) for flexibility and durability.
​Pitch & Design: Example connectors like FlexLock 3.20mm series feature 3.20mm pitch, 2-row design, and support right-angle mounting.
​Current Rating: Up to 3A for certain high-power connectors.
​Temperature Range: Operates from -40°C to +105°C, with some materials withstand +260°C for short durations.
​Layer Configuration: Available in single-sided, double-sided, or multi-layer designs (e.g., 4-layer for complex circuits).
​Copper Thickness: Ranges from 12μm (0.33oz) to 70μm (RA copper for high flexibility).
​Minimum Trace Width/Space: Typically 3/3mil (75/75μm), with advanced processes achieving 2/2mil.
​Adhesive & Coverlay: Epoxy or acrylic adhesives; coverlays protect copper traces and can be colored (yellow, black, white).
2. Product Descriptions

​Definition: FPC is a flexible circuit board made of thin, bendable substrates with embedded conductive pathways, ideal for compact and dynamic electronic designs.
​Key Features:
​Lightweight & Flexible: Weighs significantly less than rigid PCBs and can bend/fold to fit complex spaces.
​High-Density Wiring: Enables intricate circuit layouts with fine traces (down to 20μm).
​Customizability: Tailored to specific dimensions, layers, and functionality (e.g., integrating sensors or antennas).
​Applications:
​Consumer Electronics: Smartphones, tablets, wearables (e.g., folding screens).
​Automotive & Aerospace: Used in sensors, control modules, and systems requiring high reliability.
​Medical Devices: Implants, portable monitors, and flexible diagnostic tools.